Muhlbauer TAL15000 Flip Chip RFID Inlay Assembly Line

Description:

The Muhlbauer TAL15000 RFID Inlay Assembly Line with Glob Top Module is a state-of-the-art solution designed for high-speed production of RFID inlays. This advanced assembly line features precise automation and a modular design, allowing for efficient handling and processing of inlays while ensuring top-quality output. The Glob Top Module enhances reliability by providing superior protection for the integrated circuits, making it ideal for various applications across industries. With its robust performance and innovative technology, the TAL15000 streamlines the manufacturing process, helping companies meet the growing demand for RFID solutions.

Used Muhlbauer TAL15000 RFID Inlay Assembly Line with Glob Top Module:

• Throughput: up to 13000 inlays per hour
• Yield: >99.7%
• Capabilities: 
  • Single row
  • Multi row
  • Sheets
• Adhesive types: 
  • ACP (Anisotropic conductive paste)
  • NCP (Non-conductive paste)
• Web width: 100mm (3.93 inches) up to 350mm (13.77 inches)
• Dies minimum: 0.3 x 0.3mm
• Antenna materials:
  • Copper
  • Aluminum
  • Silver antenna
• Wafer sizes:
  • 6 inches
  • 8 inches
  • 12 inches
• Frame metal and plastic
• Overall dimensions: 
  • Length: 8660mm (340.94 inches)
  • Width: 1650mm (64.96 inches)
  • Height: 2070mm (81.49 inches)
• Accuracy:
  • Machine: ± 15µm
  • Die attach: ± 30µm
  • Post cure: ± 50µm
• Suitable for complete range of HF and UHF inlays 
• Electricals: 3 phase, 50/60 Hz, 400 Volts